2Pcs/50Pcs new TO-39 TO-99 Transistor Op amp amplifier aluminum alloy heat sink

Description

Matters needing attention in designing heat sink:
The larger the surface area of the heat sink, the better the heat dissipation effect;
If the heat sink is placed to facilitate air circulation, the heat dissipation effect can be improved;
Copper and aluminum have good thermal conductivity and are high-quality heat dissipation materials;
Increasing the thickness of the heat sink is more effective than increasing the length;
Surface anodizing treatment can resist oxidation and corrosion, improve radiation ability, and stabilize heat dissipation effect;
Economics of processing.
The characteristics and uses of the heat sink:
It can provide the effective volume of the space occupied by the device;
Can make the device node allow the appropriate temperature;
Can reduce the power loss of the device;
Can improve the environment (the temperature around the device, and the flow rate of air).
Table of thermal conductivity of various metals (W/mK):
Silver-429, copper-401, gold-317, aluminum-237, iron-80, tin-67, lead-34.8.
Model: For
TO-39 TO-99
Size: 8*8*16mm (inner diameter * height * outer diameter)
Material: pure aluminum
Fixed: Clamping
Condition: New