Aluminum nitride ceramic sheet / ceramic heat sink / ALN ceramic gasket

Description

Aluminum nitride ceramic sheet / ceramic heat sink / ALN ceramic gasket 50 * 50/30 * 30/10 * 10 various substrates
Aluminum nitride ceramic substrate has very good thermal conductivity and is one of the materials with good thermal conductivity in the field of thermal conduction. It is used in hybrid integrated circuit interconnect substrates, microwave devices, optoelectronic communication, sensors, MCM, optoelectronic device substrates, ceramic carriers, Laser carriers, chip capacitors, interdigital capacitors, and spiral inductors.
1. After the surface finish is polished, Ra≤0.1μm;
2. The dimensional accuracy of the product is guaranteed by laser scribing, the minimum value is ± 0.05mm;
3. Special specification products can be produced according to customer requirements, with any thickness.
Aluminum nitride ceramics have excellent thermal conductivity (7-10 times that of alumina ceramics), lower dielectric constant and dielectric loss, reliable insulation properties, excellent mechanical properties, non-toxic, high temperature resistance, and chemical corrosion resistance. And similar to the thermal expansion coefficient of silicon, as a new generation of ceramic materials, more and more attention and attention. The quality of aluminum nitride ceramics produced by our company is leading domestic similar products, with international advanced level, and is widely used in communication devices, high-brightness LEDs, power electronic devices and other industries.
AlN陶瓷基片主要性能指标
性能内容
性能指标
热导率(W
/
m·k）
≥170-200
体积电阻率（Ω·cm）
＞10
13
介电常数[1MHz,25℃]
9
介电损耗[1MHz,25℃]
3.8х10
-4
抗电强度(KV/mm)
17
体积密度（g/cm
3
）
≥3.30
表面粗糙度Ra(μm)
0.3~0.5
热膨胀系数[20℃ to 300℃](10
-6
/
℃)
4.6
抗弯强度(MPa)
320~330
弹性模量(GPa)
310~320
莫氏硬度
8
吸水率(%)
0
翘曲度(~/25(长度))
0.03~0.05
熔点
2500
外观
/
颜色
灰白色
Packing: IPC
Warranty period: 120 days
On Feb-27-20 at 21:06:08 PST, seller added the following information: