-40%
lot of 20 Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 364424b00032G
$ 13.09
- Description
- Size Guide
Description
This is alot of 20 Heat Sink Passive BGA/FPGA Pin Array Adhesive Aluminum 364424b00032G
. This is new in open box.
Product Technical Specifications
EU RoHS
Compliant
ECCN (US)
EAR99
Part Status
Active
HTS
8542.90.00.00
Type
Passive
Material
Aluminum
Fin Style
Pin Array
Device Cooled
FPGA|BGA
Attachment Method
Tape
Finish
Black Anodized
Mounting
Adhesive
Product Length (mm)
40
Product Depth (mm)
40.13
Product Height (mm)
11.43
You will
receive
the product in the picture.
The item will ship within 24 hours of completed payment.
We offer combined shipping. Send us a message for more information.
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